The Kirin 980 most probably will be launched in a conference in IFA on August 30, with many major updates. The chipset will be the first one to be manufactured on a 7nm FinFET process by TSMC. It is also expected to be having AI technology from Cambricorn, which will make its NPU more smooth and allow it do do calculations upto 5 trillion per watt. Also, it was rumoured that Huawei’s sub-brand HiSilicon that makes its chipsets will also make their own GPU for their phones this time. The GPU is rumored to be very powerful, and could be 1.5 times faster than the Adreno 630 that is the current flagship GPU from Qualcomm paired with the Snapdragon 845.
Now, screenshots of some benchmarks in Chinese have been leaked, revealing most of the specifications of the CPU.
The Octa core CPU has 4 Cortex A75 cores clocked at 2.8 Ghz, and 4 Cortex A55 cores (the clock speed is unknown). The GPU included in the benchmark results is a Mali G72 witg whopping 24 cores. It also supports LPDDR4X RAM for faster operations. Bluetooth 5 is also present for faster wireless transfers and better audio quality on wireless earphones.
The CPU will be announced on August 30, but will make its debut some times later on the Huawei Mate 20 / Mate 20 Pro. According to some earlier leaks, the Antutu score of the phone wil surpass 350,000 points. The chipset also supports upto 40W of fast charge.
All these reports suggests the Kirin 980 is a major upgrade over the Kirin 970. Also, if they turn out to be true the CPU will blow out its competition and will stand much ahead of the Snapdragon 845 and Exynos 9810. Huawei is also first to build a chipset on TSMC’s 7nm process, which will make it more power efficient and faster. But do take this news with a pinch of salt as the benchmark app also says that the CPU is unreleased, and specifications mwy also change in future. Stay tuned with us for any future updates!
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